LMJ08MF0P5R001
Products Specifications
- Package
- 0805 (2012 Metric)
- Features
- Current Sense, Industrial Grade, Thick copper conductor, Long-term stability, Stable material, Excellent reliability, Ultra-low temperature drift (Low TCR)
- Series
- LMJ08
- Operating Temperature
- -55℃ ~ +170℃
- Temperature Coefficient
- ±50ppm/°C
- Resistance
- 1 mOhms
- Power Rating
- 0.5W
- Tolerance
- 1.0%
- Mounting
- SMD / SMT
- Style
- Surface Mount Current Sensing Reistors
- Termination
- 2-Terminal
- Composition
- Metal Alloy

Description
- Thick copper conductor
- Long-term stability
- Halogen-free lead free RoHS compliant
- Stable material
- Excellent reliability
- Ultra-low temperature drift (Low TCR)
Appications
• Battery Management System (BMS)
• New energy vehicles, Charging makeup
• Charger, Smart home
• Power tools, Large household appliances
• Consumer electronics, Main board Lithium
• Protection, Clean appliances
Part Numbering System

| Parameter | Standard |
|---|---|
| Maximum rated power | 0.5W |
| Resistance Value | 3mΩ ~ 40mΩ |
| Operating Temperature Range | -55 to + 170°C |
| Component Temperature Coefficient (TCR) | ± 50ppm/°C |
| Maximum Working Voltage (V) | (P×R)1/2 |
| Rating Current (A) | (P/R)1/2 |
P=Power Rating; R=Resistance Value
Standard Electrical Specifications
| Type | Rating Power at 70℃ |
T.C.R. (ppm/℃) |
Resistance Range(mΩ) 0.5%(D),1.0%( F) 2.0%(G),5.0%(J) |
Meterial | Operating Temperature(℃) |
|---|---|---|---|---|---|
| LMJ08 | 0.5W | ±50 | 3mΩ ~ 40mΩ | MnCu | -55~+170℃ |
Construction

Unit: Millimeters
| Type | L | W | C | T |
|---|---|---|---|---|
| LMJ08 | 2.0 ±0.1 | 1.25 ±0.1 | 0.4±0.2 | 0.65± 0.2 |
Recommended land pattern
Unit: Millimeters

| Resistance Range ( Ω ) | a | b | L |
|---|---|---|---|
| 0.003~0.040 | 1.4±0.1 | 1.15±0.1 | 1.2±0.1 |
Product Characteristics
| Item | Test condition / Methods | Limited |
|---|---|---|
| Temperature coefficient of resistance | TCR =(R-R0)/R0(T2-T1)X 106 R0 : resistance of room temperature R: resistance of 125℃ T1: Room temperature T2: 125℃ ( Temperature at 125℃ ) |
Refer to Spec |
| Short Time Overload | Apply the overload for 5 seconds, and then measure the resistance change rate after standing for 24 hours. | ≤±0.5% |
| Temperature Cycling | 1000 cycles (-55℃ to 125℃), 30min at each extreme | ≤±1% |
| Low temperature Storage | -55±2℃ for 1000 hours, measure the resistance change rate after more than 1 hour | ≤±0.5% |
| High temperature Storage | 1000 hours at 125℃, measure the resistance change rate power 1.5 hours "ON", 0.5 hours "OFF", after standing 24±4 hours to measure the resistance change rate. | ≤±1% |
| Biased Humidity | 85℃±5℃, 85±5% RH 10% bias, 1000 hours, at rated power 1.5 hours "ON", 0.5 hours "OFF", after standing 24±4 hours to measure the resistance change rate. | ≤±0.5% |
| Load life | 1000 h at 70±2℃, 1.5h "ON", 0.5 h "OFF" | ≤±1% |
| Terminal bending | Apply a force of 2.5 kg to the center of the test board to depress it by 2 mm, and maintain the load for 60 seconds. | ≤±0.5% |
| Resistance to Solder Heat | 260℃±5℃, time: 10±1 sec, 1000 hours, measure the resistance change rate after more than 1 hour | ≤±0.5% |
| Solderability | Soak in the furnace at 245±5℃ for 3±1 sec. Take out and observe the solder area under a magnifying alass. | At least 95% of surface area of electrode shall be covered with new solder |
| Exposure (Storage) | Refer to MIL-STD-202 Method 108 | / |
| Joint Strength of Solder | ◆ Test item (Bendability test) Weld in the bending test plate, place on the bending test machine, press in the center of the test plate, and measure under load. | ≤±0.5% |
| ◆ Experiment item 2 (Fixation test) Weld the resistance in the rigidity test plate, place it on the end electrode test machine, apply the force in the direction of the force with the test probe with the radius of R0.5, and maintain 10 sec, and measure the resistance change rate under the load. | ≤±0.5% |
Power Derating Curve
For resistors operated in ambient temperatures 70℃, power rating shall be derated inaccording with the curve below:

IR Reflow-Soldering Profile

Wave-Soldering Profile

Tapping & Package

Unit: mm
| Type | Pack | A ±0.15 |
B ±0.2 |
D0 0.1+/-0 |
E ±0.1 |
F ±0.05 |
P0 ±0.1 |
P1 ±0.1 |
P2 ±0.1 |
W ±0.2 |
T ±0.1 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 0805 | Emboss | 1.60 | 2.40 | 1.50 | 1.75 | 3.50 | 4.00 | 4.00 | 2.00 | 8.00 | 0.84 |
Reel Specification

Unit: mm
| Type | A | B | C | D | M | W |
|---|---|---|---|---|---|---|
| LMJ08 | 2.00±0.5 | 13.5±0.5 | 21.00±0.5 | 60.00±1.0 | 178.00±2.0 | 9.00±0.5 |
Packaging
Quantity: 5, 000pcs