1206TD-1.5BP
Products Specifications
- Features
- AEC-Q200, High Inrush Current Withstand Capability, High I²t Capability, Ceramic or Glass Construction, One-Time Circuit Disconnection
- Breaking Capacity @ Rated Voltage
- 72 VDC @ 50 A
- Mounting Type
- Surface Mount
- Operating Temperature
- -55 ~ 150 ℃
- Voltage Rating
- 72 VDC
- Ampere Rating
- 1.5 A
- Typical Cold Resistance
- 0.175 Ohms
- Typical Melting I ²t (A² Sec)
- 0.65
- Size / Dimension
- 0.126 in x 0.064 in
- Package / Case
- 1206 (3216 Metric)
- Response Time
- Time Delay / Slow blow
Time Delay | 0.126x0.064 inch
Thick Film Chip Fuses
1206TD Series are the fuses set the industry standard for performance, reliability and quality. The solder-free design provides excellent on-off and temperature cycling characteristics during use and also makes our SMD fuses more heat and shock tolerant than typical subminiature fuses.
Features
- High inrush current withstanding capability
- AEC-Q200 Automotive Grade Certified
- Compatible with reflow and wave solder
- Ceramic and glass construction
- Excellent environmental integrity
- One time positive disconnect
- Lead Free and Halogen free material
Appications
- Flat panel displays and televisions
- Automotive infotainment and ECU
- Computer servers
- Portable electronics
- Mobile device chargers
- Power Battery Packs
Electrical Characteristics
| Rated Current | % of Amp Rating | Opening Time |
|---|---|---|
| 1.5 ~ 4 A | 100% | 4 hours min. |
| 1.5A ~ 4 A | 300% | 5 Seconds Max. |
Specifications
| Part Number | Ampere Rating (A) | Voltage Rating / Interrupting Rating | Typical Cold Resistance (Ω) | Typical Melting I²t (A²Sec) | Typical Voltage Drop (V) | Marking Code |
|---|---|---|---|---|---|---|
| 1206TD-1.5BP | 1.50 | 72 Vdc @ 50 A 63 Vdc @ 50 A |
0.175 | 0.65 | 0.400 | K |
| 1206TD-2BP | 2.00 | 0.110 | 0.88 | 0.300 | N | |
| 1206TD-3BP | 3.00 | 0.040 | 2.0 | 0.170 | P | |
| 1206TD-4BP | 4.00 | 0.026 | 3.2 | 0.160 | S |
- DC Interrupting Rating (Measured at rated voltage, time constant of less than 50 microseconds, battery source)
- DC Cold Resistance are measured at <10% of rated current in ambient temperature of 25℃
- Typical Pre-arcing I²t are measured at 10In Current.
- Choice fuse for surge application (USB charger etc.), make sure the I²t of fuse is 4 times than surge.
- Specifications are subject to change without notice. Application testing is strongly recommended
Dimension
Unit: mm/inch
Pad layout
Packaging
- Quantity: 3 000pcs
- 8mm wide tape on 178mm(7 inch) diameter reel -specification EIA Standard 481.
Soldering Parameters
Wave Soldering: 260°C, 10 seconds max.
Infrared Reflow: 260°C, 30 seconds max.
IR Reflow Profile
| Preheat Heat | |
|---|---|
| Temperature Min (Tsmin) | 150°C |
| Temperature Max (Tsmax) | 200°C |
| Time (Tsmin to Tsmax), ts | 60 – 120 seconds |
| Average Ramp-up Rate (Tsmax to Tp) | 3°C/second max. |
| Liquidous Temperature (TL) | 217°C |
| Time at Liquidous (tL) | 60 – 150 seconds |
| Peak Temperature (Tp) | 260 °C |
| Time within 5°C of actual Peak Temperature (tp) | 30 seconds |
| Average Ramp-down Rate (Tp to Tsmax) | 6°C/second max. |
| Time 25°C to Peak temperature | 8 minutes max. |
Temperature Derating Curve
- Normal ambient temperature: 23+/-3℃
- Operating temperature: -55 ~ 150℃, with proper correction factor applied
Average Time Current Curves
