1206TD-R630

Products Specifications

Features
AEC-Q200, High Inrush Current Withstand Capability, High I²t Capability, Ceramic or Glass Construction, One-Time Circuit Disconnection
Breaking Capacity @ Rated Voltage
50 A @ 72 VDC
Mounting Type
Surface Mount
Operating Temperature
-55 ~ 150 ℃
Voltage Rating
72 VDC
Ampere Rating
0.63 A
Typical Cold Resistance
1.08 Ohms
Typical Melting I ²t (A² Sec)
0.009
Size / Dimension
0.126 in x 0.064 in
Package / Case
1206 (3216 Metric)
Response Time
Time Delay / Slow blow

Time Delay | 0.126x0.064 inch

Thick Film Chip Fuses

1206TD Series are the fuses set the industry standard for performance, reliability and quality. The solder-free design provides excellent on-off and temperature cycling characteristics during use and also makes our SMD fuses more heat and shock tolerant than typical subminiature fuses.

Features

  • High inrush current withstanding capability
  • AEC-Q200 Automotive Grade Certified
  • Compatible with reflow and wave solder
  • Ceramic and glass construction
  • Excellent environmental integrity
  • One time positive disconnect
  • Lead Free and Halogen free material

1206TD-R630

Appications

  • Flat panel displays and televisions
  • Automotive infotainment and ECU
  • Computer servers
  • Portable electronics
  • Mobile device chargers
  • Power Battery Packs

Electrical Characteristics

Amp Rating % of Amp Rating Opening Time
0.63~30A 100% 4 Hours Min.
0.63~3A 200% 1 sec – 60 sec
0.63~5A 250% 5 Seconds Max.
0.63~5A 300% 0.1 sec – 3 sec
6~50A 350% 5 Seconds Max.
0.63–50A 1000% 0.2 ms – 20 ms

Specification

Part Number Ampere Rating (A) Interrupting Rating / Voltage Rating Typical Cold Resistance (Ohms) Typical Melting I²t (A²Sec) Typical Voltage Drop (V) Marking Code
1206TD-R630 0.63 50 A @ 72 Vdc
50 A @ 63 Vdc
 
1.08 0.009 0.950 B
1206TD-R750 0.75 0.85 0.01 0.900 0.75
1206TD-1A 1.00 0.48 0.11 0.510 H
1206TD-1.25A 1.25 0.33 0.15 0.500 H
1206TD-1.5A 1.50 0.23 0.17 0.465 K
1206TD-1.75A 1.75 0.18 0.20 0.450 E
1206TD-2A 2.00 0.135 0.41 0.316 N
1206TD-2.5A 2.50 0.075 0.68 0.240 O
1206TD-3A 3.00 0.047 1.5 0.187 P
1206TD-3.5A 3.50 0.038 2.0 0.180 R
1206TD-4A 4.00 0.034 2.5 0.173 S
1206TD-4.5A 4.50 50 A @ 32 Vdc
300 A @ 24 Vdc
0.029 2.65 0.164 X
1206TD-5A 5.00 0.024 4 0.145 T
1206TD-6A 6.00 0.016 12 0.140 F
1206TD-7A 7.00 0.0123 14 0.130 7
1206TD-8A 8.00 150 A @ 32 Vdc
300 A @ 24 Vdc
0.0083 16 0.123 M
1206TD-10A 10.0 0.0065 22 0.110 U
1206TD-12A 12.0 0.0050 11.5 0.085 12
1206TD-15A 15.0 0.0037 16.5 0.078 15
1206TD-20A 20.0 0.0034 50 0.080 Q
1206TD-25A 25.0 0.0016 60 0.090 L
1206TD-30A 30.0 0.0013 100 0.090 Z
1206TD-40A 40 200 A @ 32 Vdc
200 A @ 24 Vdc
0.00085 240 0.095 XL
1206TD-50A   0.00070 260 0.095 50

Note:

  • DC Interrupting Rating (Measured at rated voltage, time constant of less than 50 microseconds, battery source)
  • DC Cold Resistance are measured at <10% of rated current in ambient temperature of 25℃
  • Typical Pre-arcing I²t are measured at 10In Current

Dimension

Unit: mm/inch

1206TD-R630

Pad layout

1206TD-R630

Pad layout

  • Quantity: 3 000pcs
  • 8mm wide tape on 178mm(7 inch) diameter reel -specification EIA Standard 481.

Soldering Parameters

1206TD-R630

Wave Soldering: 260°C, 10 seconds max. 

Infrared Reflow: 260°C, 30 seconds max.

IR Reflow Profile

Preheat Heat
Temperature Min (Tsmin) 150°C
Temperature Max (Tsmax) 200°C
Time (Tsmin to Tsmax), ts 60 – 120 seconds
Average Ramp-up Rate (Tsmax to Tp) 3°C/second max.
Liquidous Temperature (TL) 217°C
Time at Liquidous (tL) 60 – 150 seconds
Peak Temperature (Tp) 260 +0/-5°C
Time within 5°C of actual Peak Temperature (tp) 10 – 30 seconds
Average Ramp-down Rate (Tp to Tsmax) 6°C/second max.
Time 25°C to Peak temperature 8 minutes max.

Temperature Derating Curve

1206TD-R630

  • Normal ambient temperature: 23+/-3℃
  • Operating temperature: -55 ~ 150℃, with proper correction factor applied

Average Time Current Curves

1206TD-R630
1206TD-R630
1206TD-R630

 

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