APSRP25

Features

  • Metal Alloy Low-Resistance shunt resistor.
  • Resistance valu 0.4mΩ.
  • Low thermal EMF.
  • Low TCR.
  • Very low inductance.
  • Halogen free, lead free and RoHS compliant.
  • AEC-Q200 qualified available.

Applications

  • Power modules.
  • Frequency converters.
  • Current sensor for power hybrid sources high current for automotive.
  • Lithium battery protection board.

Part Number

APSRP25

【1】Series Name: Prosemi Shunt Resistor for Automotive.

【2】Chip Size: 25 : 2512;

【3】Material: S: CuMnSn.

【4】Power Rating: 6=6W.

【5】Resistance Precision: D:±0.5%;F: ±1% ;G: ±2%;J:±5%;

【6】Resistance Code: 0M40: 0.4mΩ .

【7】Internal Code: X

Electrical Characteristics

Size Power
Rating at
70℃ (W)
Resistance Range (mΩ)** Element
Material
Resistance
Tolerance (%)
Operation
Temperature
Range
Temperature
Coefficient
(ppm/℃)
2512 6 0.4 S ±0.5; ±1; ±2; ±5 -65℃ ~ +170℃ ±175

“*” : Power at terminal temperature of 70℃ .

“* *”: Development schedule will vary depending on resistance value. Please contact us for resistance values.

Physical Dimensions

APSRP25

Unit: mm

Size Resistance (mΩ) L W A P Element Material
2512 0.4 6.4±0.2 3.2±0.2 1.10±0.2 0.45±0.1 S

Recommended Solder Pad Layout

APSRP25

Unit: mm

Type Resistance (mΩ) c a b
2512 0.4 7 3.4 1.8

Test Point

APSRP25

Type Resistance (mΩ) L1 (mm) L2 (mm) W (mm)
2512 0.4 5.6 5.6 1.4

Construction

APSRP25

Power Derating Curve

For resistors operated in ambient temperatures 70°C, power rating shall be derated in according with the curve below:

APSRP25

Recommended Solder Curve

APSRP25

Reflow Condition Pb – Free assembly
Pre heat - Temperature Min (Ts(min)) 150°C
- Temperature Max (Ts(max)) 200°C
- Time (Min to Max) (ts) 60 – 120 secs
Average ramp up rate (Liquidus Temp (TL) to peak) 5°C/second max
TS(max) to TL - Ramp-up Rate 5°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Time (tL) 60 – 150 seconds
Peak Temperature (TP) 260°C
Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds
Ramp-down Rate 5°C/second max
Time 25°C to peak Temperature (TP) 8 minutes Max.
Wave Soldering Not applicable
Hand Soldering 350°C, 5 seconds max.

Product Marking

APSRP25

2512

1,The characters and directions are shown in the figure above:

2,Encoding rules: "0M40":0.4m Ω ;

Product Characteristics

Item Test condition/ Methods Limited Standard
Resistance Measuring resistance value at room temperature 25℃±5℃ Refer to Spec IEC60115-1 6.1
Temperature
Coefficient of Resistance
TCR(ppm/°C) = (R2-R1/R1*(T2-T1))×10⁶
R1: resistance at room temperature (Ω)
R2: resistance at 125°C (Ω)
T1: room temperature (°C)
T2: 125°C
Refer to Spec MIL-STD-202 Method 304
Short Time Overload Apply 5 times rated power for 5 seconds, measure resistance change after 24h. ±1% IEC 60115-1 8.1
High Temperature Storage 170℃ for 1000 hours, no power ±1% MIL-STD-202 Method 108
Temperature Cycling -55℃ (15min) / +150℃ (15min), 1000 cycles, transition <1min ±1% JESD22 Method JA-104
Operational life 70℃±2℃, 1000h, at rated power (1.5h ON / 0.5h OFF) ±1% IEC 60115-1 7.1
Mechanical shock Condition C, 100g, 6ms, 3 axes × 6 directions, 3 impacts each (18 shocks) ±1% MIL-STD-202 Method 213
Vibration 5g for 20min, 12 cycles each of 3 orientations, 10Hz–2000Hz ±1% MIL-STD-202 Method 204
Resistance to Soldering Heat Condition K, above 217°C, 60–150s ±0.5% MIL-STD-202 Method 210
Solderability 245±5℃, 5s (+0/-0.5s) ≥95% J-STD-002
Bias Humidity +85℃, 85%RH, 10% of operating power, 1000h ±1% MIL-STD-202 Method 103
Board Flex Bending distance: 2mm, 60±5s ±1% AEC-Q200-005

Packaging

Tape Dimensions

APSRP25

2512

Unit: mm

Series Type A(mm) B(mm) E(mm) F(mm) W(mm) T(mm)
2512 0.4mΩ 3.50±0.10 6.70±0.10 1.75±0.10 5.50±0.10 12.00±0.10 0.20±0.05
Series Type P0(mm) P1(mm) P2(mm) D0(mm) D1(mm) K0(zmm)
2512 0.4mΩ 4.00±0.10 4.00±0.10 2.00±0.10 1.50±0.10 1.50±0.10 1.65±0.10

Reel Dimensions

APSRP25

Unit:mm

Series Type A(mm) N(mm) C(mm) D(mm) W1(mm)
2512 0.4mΩ 178.0±2.0 60.0±1.0 13.5±0.5 21±0.8 13.6±0.5

Quantity of Package

Series Type Quantity(pcs)
2512 0.4mΩ 2500

Storage

1. The temperature condition must be controlled at 25 ±5℃, The R.H. must be controlled at 60 ±15% Store in accordance with this requirement, and the validity period is two years after the date of manufacture.

2. Please avoid the mentioned harsh environment below when storing to ensure product performance and its’ solderability. Places exposed to sea breeze or other corrosive gas, such as Cl2 , H2S, NH3 , SO2 and NO2.

3. When the product is moved and stored, please ensure the correct orientation of the box. Do not drop or squeeze the box. Otherwise, the electrode or the body of the product may be

damaged.

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