0402FA-1.25A
Fast Acting | 0.04x0.02 inch
Thick Film Chip Fuses
0402FA Series Chip fuses set the industry standard for performance, reliability and quality. The solder-free design provides excellent on-off and temperature cycling characteristics and also makes our chip fuses more heat and shock tolerant than typical subminiature fuses.
Features
- Fast acting for excessive current
- Compatible with reflow and wave solder
- Ceramic and glass construction
- Excellent environmental integrity
- One time positive disconnect
- Lead Free and Halogen free materia
Appications
- Flat panel displays and televisions
- Automotive infotainment and ECU
- Computer servers
- Portable electronics
- Mobile device chargers
Electrical Characteristics
| Amp Rating (A) | % of Amp Rating | Opening Time |
|---|---|---|
| 0.20 ~ 4A | 100% | 4 hours min |
| 1 ~ 4A | 250% | 5 seconds max |
| 0.20 ~ 0.75A | 300% | 5 seconds max |
Specifications
| Part Number | Amp Rating (A) | Voltage Rating (Vdc) | Interrupting Rating | Typical Cold Resistance (Ω) | Typical Melting I²t (A²s) |
|---|---|---|---|---|---|
| 0402FA-R200 | 0.200 | 32 | 32V @ 35A | 2.250 | 0.0006 |
| 0402FA-R250 | 0.250 | 32 | 32V @ 35A | 1.500 | 0.0010 |
| 0402FA-R315 | 0.315 | 32 | 32V @ 35A | 1.000 | 0.0014 |
| 0402FA-R375 | 0.375 | 32 | 32V @ 35A | 0.780 | 0.0018 |
| 0402FA-R500 | 0.500 | 32 | 32V @ 35A | 0.500 | 0.0043 |
| 0402FA-R750 | 0.750 | 32 | 32V @ 35A | 0.220 | 0.0110 |
| 0402FA-1A | 1.00 | 32 | 32V @ 35A | 0.130 | 0.0400 |
| 0402FA-1.25A | 1.25 | 32 | 32V @ 35A | 0.100 | 0.0480 |
| 0402FA-1.5A | 1.50 | 32 | 32V @ 35A | 0.078 | 0.0600 |
| 0402FA-2A | 2.00 | 32 | 32V @ 35A | 0.040 | 0.1300 |
| 0402FA-2.5A | 2.50 | 32 | 32V @ 35A | 0.024 | 0.2000 |
| 0402FA-3A | 3.00 | 32 | 32V @ 35A | 0.018 | 0.3300 |
| 0402FA-3.5A | 3.50 | 32 | 32V @ 35A | 0.014 | 0.4500 |
| 0402FA-4A | 4.00 | 32 | 32V @ 35A | 0.011 | 0.6000 |
- DC Interrupting Rating (Measured at rated voltage, time constant of less than 50 microseconds, battery source);
- DC Cold Resistance are measured at <10% of rated current in ambient temperature of 25 degrees;
- Typical Melting I2 t (Measured with a battery bank at rated DC voltage, Measured at 1ms open time, time constant of calibrated circuit less than 50 microseconds).
Dimension
Unit: mm/inch
Pad layout
Packaging
- Quantity: 10 000pcs
- 8mm wide tape on 178mm(7 inch) diameter reel -specification EIA Standard 481.
Soldering Parameters
Wave Soldering: 260°C, 10 seconds max.
Infrared Reflow: 260°C, 30 seconds max.
IR Reflow Profile
| Preheat Heat | |
|---|---|
| Temperature min (Tsmin) | 150°C |
| Temperature max(Tsmax) | 200°C |
| Time (Tsmin to Tsmax) (ts) | 60 -120 seconds |
| Average ramp-up rate(Tsmax to Tp) | 3°C/second max. |
| Liquidous temperature (TL) | 217°C |
| Time at liquidous(tL) | 60 -150 seconds |
| Peak temperature(Tp) | 260+0/-5°C |
| Time within 5°C of actual peak Temperature (tp) | 30 seconds |
| Average ramp-down rate (Tp to Tsmax) | 6°C/second max. |
| Time 25 °C to peak temperature | 8 minutes max. |
Temperature Derating Curve
- Normal ambient temperature: 23+/-3℃
- Operating temperature: -55 ~ 150℃, with proper correction factor applied
Average Time Current Curves
