0402FA-R500-L
Ultra-Thin Fuse|0.04x0.02’’
Fast Acting series Thin Film Chip Fuse
Features
- Very fast acting at 200% overload current
- l Low DCR
- l High inrush current withstanding capability
- l High reliability
- l Fiberglass enforced epoxy fuse body
- l Copper termination with nickel and tin plating layer
- l Halogen free, RoHS compliance & lead-free
Application
- lPanel
- HDD
- lToy
- lIoT
- lBattery pack
- lFinger print
- lSmart lock
- lNotebook
Electrical Characteristics
| % of Current Rating | Opening Time |
|---|---|
| 100% | 4hours min. |
| 200% | 5second max. |
| 300% | 0.2second max. |
Specifications
| Part No. | Current Rating(A) |
Voltage Rating (Vdc) |
Interrupting Rating |
Typical Cold DCR (Ω) |
Typical I2t (A2Sec)* |
Marking |
|---|---|---|---|---|---|---|
| 0402FA-R500-L | 0.5 | 35 | 35A @35V | 0.165 | 0.007 | = |
*Typical I2t: i.e. melting I2t at 0.001s of current rating
Dimension
Packaging
- Quantity:10, 000pcs
- l 8mm wide tape on 178mm (7 inch) diameter reel -specification EIA Standard 481
Soldering Parameters
Wave Soldering: 260°C, 10 seconds max .
Infrared Reflow: 260°C, 30 seconds max .
IR Reflow Profile
| Preheat Heat | |
|---|---|
|
Temperature min (Tsmin）
|
150°C
|
|
Temperature max(Tsmax)
|
200°C
|
|
Time (Tsmin to Tsmax) (ts)
|
60 -120 seconds
|
|
Average ramp-up rate (Tsmax to Tp)
|
3°C/second max.
|
|
Liquidous temperature (TL)
|
217 °C
|
|
Time at liquidous (tL)
|
60 - 150 seconds
|
|
Peak temperature(Tp)
|
260°C
|
|
Time within 5°C of actual peak
Temperature (tp)
|
30 seconds
|
|
Average ramp-down rate (Tp to
Tsmax)
|
6°C/second max.
|
|
Time 25 °C to peak temperature
|
8 minutes max.
|
Temperature Effect on Current Rating
- Normal ambient temperature: 23+/-3℃
- Operating temperature: -55 ~ 105℃
Average Time-Current curve
