DHC45-20A
High Current Brick Fuse
1560A
Descriptions
- High current brick fuse
- Surface mount deign to save space
- Ceramic Suqare body with end cap design
- Designed to UL248-1/14
- Fully compatible with lead-free solder and high temperature profile associated with lead-free assembly
Applications
- Power battery protection
- Test equipment
- Power supplies
- Game systems
- Industrial equipment
- Telecom system
Electrical Characteristics
| Amp Rating | % of Amp Rating | Opening Time |
|---|---|---|
| 15~60A | 1.0 In | 4 hour min. |
| 3.5 In | 10s max. |
Specifications
| Part No. | Rated Current (A) |
Rated Voltage (V) |
Breaking Capacity DC ¹ |
Typ. Cold Resistance (mΩ) |
Typical Voltage Drop (mV) |
Pre-Arcing I²t (A²sec) ² |
|---|---|---|---|---|---|---|
| DHC45-15A | 15 | 85Vdc ³ 72Vdc 63Vdc 60Vdc ⁴ |
85Vdc @ 1000A 72Vdc @ 1000A 63Vdc @ 1000A 60Vdc @ 1500A |
4.42 | 90 | 210 |
| DHC45-20A | 20 | 3.10 | 85 | 340 | ||
| DHC45-25A | 25 | 1.57 | 55 | 300 | ||
| DHC45-30A | 30 | 1.26 | 55 | 500 | ||
| DHC45-35A | 35 | 1.07 | 55 | 750 | ||
| DHC45-40A | 40 | 0.85 | 53 | 1200 | ||
| DHC45-50A | 50 | 0.65 | 45 | 2300 | ||
| DHC45-60A | 60 | 0.56 | 40 | 2800 |
1.DC Interrupting Rating (Measured at designated voltage, time constant of less than 50 microseconds, battery source)
2.Typical Pre-arcing I2t are measured at 10In Current, DC battery bank, but not exceeding the interrupting rating, time constant of calibrated circuit less than 50 microseconds)
3.TUV Approval is 85/72/63Vdc,1000A, UL Approval is 72/63Vdc, 1000A
4.Self-certified for 60Vdc/1500A.
Dimension
Unit: mm
Pad layout
Recommend trace trace thickness thickness isis 3oz,the the minimum minimum trace trace width width isis 15mm, 15~35A
Recommend trace trace thickness thickness isis 3oz the the minimum minimum trace trace width width isis 22mm, 40~60A
Recommend solder thickness is 0.15mm;
Soldering Parameters
IR Reflow Profile
| Preheat Heat | |
|---|---|
| Temperature min (Tsmin) | 150°C |
| Temperature max(Tsmax) | 200°C |
| Time (Tsmin to Tsmax) (ts) | 60 -120 seconds |
| Average ramp-up rate (Tsmax to Tp) | 3°C/second max . |
| Liquidous temperature (TL) Time at liquidous (tL) | 217°C 60 - 150 seconds |
| Peak temperature(Tp) | 260°C |
| Time within 5°C of actual peak Temperature (tp) | 20 seconds |
| Average ramp-down rate (Tp to Tsmax) | 6°C/second max . |
| Time 25 °C to peak temperature | 8 minutes max . |
Soldering Characteristics
Reflow Soldering
- Temperature: 260° C
- Time: 30 Seconds Maximum
Manual Soldering (not recommended)
- Temperature: 350° C
- Time: 5 Seconds Maximum
Time-Current Curves
