SRF0603P125LR

Features

  • Resettable over current and over temperature protection Standard 0402mils footprint
  • Fast time-to-trip
  • RoHS complaint
  • Low resistance

Applications

  • USB peripherals including new USB 3.0 / 2.0 ports
  • Li-ion / Li-Polymer battery packs
  • Smart phones
  • E-readers
  • LCD / LED HDTV Tablet , Notebook PCs and Computer peripherals Digital cameras and video cameras
  • Hard disk drives
  • Game consoles

SRF0603P125LR

Electrical Characteristics

Part Number IH
(A)
IT
(A)
Vmax
(V)
Imax
(A)
Time to Trip Pdtyp
(W)
Rmin
(Ω)
R1max
(Ω)
(A) (Sec.)
SRF0603P035LR 0.35 0.70 6 50 8.00 0.10 0.70 0.065 0.420
SRF0603P050LR 0.50 1.00 6 50 8.00 0.10 0.50 0.060 0.350
SRF0603P075LR 0.75 1.50 6 50 8.00 2.00 0.50 0.038 0.250
SRF0603P100LR 1.00 2.00 6 50 8.00 2.00 0.50 0.020 0.100
SRF0603P110LR 1.10 2.20 6 50 8.00 0.30 0.50 0.030 0.120
SRF0603P125LR 1.25 2.50 6 50 8.00 0.40 0.50 0.015 0.095
SRF0603P150LR 1.50 3.00 6 50 8.00 2.00 0.50 0.015 0.085
SRF0603P175LR 1.75 3.50 6 50 8.00 5.00 0.50 0.009 0.070
SRF0603P200LR 2.00 4.00 6 50 8.00 5.00 0.70 0.008 0.065
SRF0603P250LR 2.50 5.00 6 50 8.00 5.00 0.60 0.004 0.050
SRF0603P260LR 2.60 5.20 6 50 8.00 5.00 1.10 0.007 0.060
SRF0603P300LR 3.00 6.00 6 50 8.00 5.00 1.10 0.006 0.055

IH=Hold current: maximum current at which the device will not trip at 25℃ still air.
IT=Trip current: minimum current at which the device will always trip at 25℃ still air.
Vmax=Maximum continuous voltage device can withstand without damage at rated current
Imax=Maximum fault current device can withstand without damage at rated voltage.

Ttrip=Maximum time to trip(s) at assigned current.
Pdtyp=Typical power dissipation: typical amount of power dissipated by the device when in state air environment.
Rmin=Minimum resistance of device in initial (un-soldered) state.
R1max=Maximum resistance of device at 25℃ measured one hour after reflow.

Noted: All electrical function test is conducted after PCB mounted.

Thermal Derating Chart

Hold Current (A)

Part Number Ambient Operating Temperature
-40°C -20°C 0°C 25°C 40°C 50°C 60°C 70°C 85°C
SRF0603P035LR 0.49 0.46 0.40 0.35 0.30 0.26 0.23 0.19 0.14
SRF0603P050LR 0.73 0.66 0.58 0.50 0.43 0.36 0.32 0.28 0.22
SRF0603P075LR 1.05 0.98 0.86 0.75 0.64 0.56 0.49 0.41 0.30
SRF0603P100LR 1.40 1.30 1.15 1.00 0.85 0.75 0.65 0.55 0.40
SRF0603P110LR 1.60 1.40 1.30 1.10 1.00 0.85 0.75 0.65 0.55
SRF0603P125LR 1.82 1.65 1.44 1.25 1.06 0.90 0.80 0.70 0.56
SRF0603P150LR 2.50 2.25 2.00 1.50 1.32 1.15 1.00 0.85 0.60
SRF0603P175LR 2.50 2.25 2.00 1.75 1.50 1.32 1.15 1.00 0.85
SRF0603P200LR 2.80 2.60 2.30 2.00 1.70 1.50 1.30 1.10 0.80
SRF0603P250LR 4.30 3.70 3.15 2.50 2.00 1.85 1.55 1.10 0.90
SRF0603P260LR 4.40 3.80 3.25 2.60 2.10 1.95 1.65 1.20 1.00
SRF0603P300LR 4.40 3.90 3.45 3.00 2.55 2.10 1.95 1.65 1.20

Notes: The temperature rerating data is for reference only. Please contact PROSEMI technical support for detail temperature rerating information.

Dimensions (mm)

SRF0603P125LR

Recommended Pad Layout (mm)

SRF0603P125LR

Part Number Marking A B C D
Min. Max. Min. Max. Min. Max. Min.
SRF0603P035LR C 1.45 1.85 0.65 1.05 0.35 0.75 0.20
SRF0603P050LR F 1.45 1.85 0.65 1.05 0.35 0.75 0.20
SRF0603P075LR H 1.45 1.85 0.65 1.05 0.35 0.75 0.20
SRF0603P100LR I 1.45 1.85 0.65 1.05 0.35 0.75 0.20
SRF0603P110LR I 1.45 1.85 0.65 1.05 0.35 0.75 0.20
SRF0603P125LR J 1.45 1.85 0.65 1.05 0.35 0.75 0.20
SRF0603P150LR L 1.45 1.85 0.65 1.05 0.35 0.75 0.20
SRF0603P175LR O 1.45 1.85 0.65 1.05 0.35 0.75 0.20
SRF0603P200LR S 1.45 1.85 0.65 1.05 0.35 0.75 0.20
SRF0603P250LR T 1.45 1.85 0.65 1.05 0.35 0.75 0.20
SRF0603P260LR Z 1.45 1.85 0.65 1.05 0.50 0.90 0.20
SRF0603P300LR Z 1.45 1.85 0.65 1.05 0.50 0.90 0.20

Solder Reflow Conditions

Reflow Profile Lead free
Heating rate from Tsmax to Tp Max. 3℃/second
Pre-heat:
Tsmin
Tsmax
Tsmin to Tsmax
150℃
200℃
60~180 seconds
Soldering time:
Temperature (TL)
Time (tL)
>217℃
60~150 seconds
Peak temperature (Tp) 260℃
Time at Peak temperature ±5℃ (tp) 20~40 seconds
Cooling rate Max. 6℃/second
Time from 25℃ to Peak Temperature 8 minutes max

SRF0603P125LR

Cautions for Reflow:

1. Recommended reflow methods: IR, hot air oven, nitrogen oven;
2. The printed solder thickness is not over 0.25mm,Excess solder may cause a short circuit, especially during hand soldering;
3. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements;
4. Device can not be wave soldered. Please contact Prosemi for hand soldering and dip soldering recommendations;
5. Device can’t contact solvent;

Note:All temperature in top chart is measured on the surface of devices.

Packaging Options

I hold(A) Quantity
0.35~3.00 5,000pcs

Reel packaging per EIA-481-1 standard

PROSEMI TECHNOLOGY

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