ALMP25 Current Sense Resistor

ALMP25

Features

  • Proprietary processing technique produces extremely low resistance values
  • Very low inductance
  • Low thermal EMF
  • Metallic Material
  • AEC-Q200 qualified available

  Part Numbering System

ALMP25

Parameter Standard
Power Rating 1mΩ~100mΩ: 3W 101mΩ~500mΩ : 2W
Resistance Value 1~500mΩ
Operating Temperature Range -55 to +170°C
Component Temperature Coefficient (TCR) ± 50 ppm/°C
Maximum Working Voltage (V) (P x R)1/2
Rating Current (A) (P / R)1/2

P=Power Rating; R=Resistance vaIue

 

Standard Electrical Specifications

  Type   Rating Power at 70℃   T.C.R.   (ppm/℃) Resistance Range(mΩ) 0.5%(D) 1.0%(F) 2.0%(G) 5.0%(J)   Meterial   Electrode     Operating Temperature(℃)
  ALMP25 2W 50 101-500 R101- R500:Karma R101-R500:Narrow   -55~+170°C
3W 50 1-4 R001- R004: NiCu R001-R004:Wide
1-100 R001-R100: NiCu R001R100:Narrow


Construction

ALMP25

Unit: Millimeters

Type Power L W C T
  ALMP25 2W&3W 6.4 ±0.2 3.2 ±0.2 0.95±0.25 (Narrow)
  0.9±0.2
2.1±0.25(Wide)

Marking

For ALMP25-S(Wide electrodes)

(1) R≤4mΩ & P/N with "-S", the marking pattern is as follows.

ALMP25

Resistance value is expressed by 4 digits. 

E.G.:

R002 = 0.002Ω = 2mΩ

 R004 = 0.004Ω = 4mΩ

 

For ALMP25(Narrow electrodes)

(1) R>1mΩ & P/N without "-S", the marking pattern is as follows.

ALMP25

Resistance value is expressed by 4 digits. 

E.G.:

R010 = 0.010Ω = 10mΩ

R020 = 0.020Ω = 20mΩ 

Recommend land pattern

ALMP25

Unit: Millimeters

Resistance Range ( Ω ) a b L
0.001-0.004(Wide) 4.0±0.1 3.1±0.1 1.3±0.1
0.001~0.500(Narrow) 4.0±0.1 2.1±0.1 4.1±0.1

Power Derating Curve

For resistors operated in ambient temperatures 70°C, power ratingshall be derated inaccording with the curve below:

ALMP25

 

Recommended Solder Curve

ALMP25

Reflow Condition Pb – Free assembly
  Pre heat - Temperature Min (Ts(min)) 150°C
- Temperature Max (Ts(max)) 200°C
- Time (Min to Max) (ts) 60 – 120 secs
Average ramp up rate (Liquidus Temp (TL) to peak 5°C/second max
TS(max) to TL - Ramp-up Rate 5°C/second max
  Reflow - Temperature (TL) (Liquidus) 217°C
- Time (tL) 60 – 150 seconds
Peak Temperature (TP) 260°C
Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds
Ramp-down Rate 5°C/second max
Time 25°C to peak Temperature (TP) 8 minutes Max.
Wave Soldering 260°C, 10 seconds max.
Hand Soldering 350°C, 5 seconds max.

Product Characteristics 

Item Test condition/ Methods Limited Standard
Resistance Measuring resistance value at room temperature 25℃±5℃ Refer to Spec IEC60115-1 4.5
    Temperature coefficient of resistance TCR=(R-R0)/R0  (T2-T1)×106 R0 :resistance of roomtemperature R:resistance of 125℃ T1 :Room temperature T2 : Temperature at 125℃     Refer to Spec     MIL-STD-202 Method 304
  Short time Overload Apply overload for 5 seconds, then measure the change in resistance after 24 hours of    rest.  
Type Power(W) # of rated power
2512 2 5 times
2512 3 0.5mR~100mR*5 times 101mR~500mR*4 times
  ≤±0.5%   MIL-R-26E
Biased Humidity +85℃, 85% RH ,10%bias,1.5h"NO",0.5h" OFF" ,1000hours ≤±0.5% MIL-STD-202 Method 103
  Solderability Immerse in the furnace at 245 ± 5℃for 3 ± 1 seconds, then take it out and put it under a    magnifying glass to observe the solder area The electrode shall cover more than 95% of new tin. MIL-STD-202 Method 210
Temperature Cycling -55℃ (30min)/+125℃(30min), 1000 cycles ≤±0.5% MIL-STD-202 Method107G
Low temperature Storage -55℃ for 1000hours, No power ≤±0.5% MIL-STD-26E
High Temperature Storage 125℃ for 1000hours, No power ≤±1% IEC6011501-4.25
Load Life 70℃± 2℃, 1000 hours, at rated power 1.5 hours "ON", 0.5 hours "OFF" ≤±1% MIL-STD-202 Method 210
Resistance to Solder Heat 260±5℃, 10±1s ≤±0.5% MIL-STD-202 Method 210
Solderability Immerse in the furnace at 245 ± 5℃for 3 ± 1 seconds, then take it out and put it under a    magnifying glass to observe the solder area The electrode shall cover more than 95% of new tin.   J-STD-002
Joint Strength of Solder Welded in the bending test plate, placed on  the bending test machine, apply force in the center of the test plate, and measure thechange rate of resistance value under load. ≤±0.5% JIS-C5201

 

Tapping & Package

ALMP25

  Type   Pack A ±0.2 B ±0.2 D0 +0.5-0 E ±0.1 F ±0.05 P0 ±0.1 P1 ±0.1 P2 ±0.1 W ±0.2 D1 ±0.05 T ±0.15
2512 Emboss 3.60 6.90 1.50 1.75 5.50 4.00 4.00 2.00 12.00 1.50 1.20

 

Reel Specification

ALMP25

Type A B C D M W
2512 2.00±0.5 13.50±0.5 21.00±0.5 80.00±1.0 178.00±2.0 13.80±0.5

 

Packaging

Quantity: 4, 000pcs

12mm wide tape on 178mm(7inch)

diameter reel -specification EIA

Standard 481.

Peel strength of upper belt

Stripping speed: 300 mm / min; The peel force is between 0.1N and 0.7N.

ALMP25

 

Storage conditions & shelf life

It can be stored for 2 years under closed conditions with temperature of 5 ° C ~ 35 ° C and relative humidity of 40 ~ 75

Please avoid the following harsh environment during storage to avoid affecting the product

performance and solder connectivity: the places with corrosive gases such as sea breeze, Cl2 , H2S, NH3 , SO2 and NO2 shall be stored without direct sunlight.

 

Precautions for product use

When measuring the resistance value before welding, a special resistance meter with high precision shall be used. When measuring, a 4-wire probe or fixture must be used. 4. When measuring parts with a wire    measuring needle, the 4 measuring needles must indeed contact the parts.

Avoid damaging the protective layer during manual welding or clamping with tweezers.

When the PCB is divided or fixed on the support, be careful to avoid excessive bending causing mechanical stress to the resistor.

It shall be used within the rated power range within the specification, especially when the power exceeds the rated value, which may affect the reliability of the product

 

 

 

 

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