Description
- Proprietary processing technique produces extremely low resistance values
- Very low inductance
- Low thermal EMF
- Metallic Material
Part Numbering System

Parameter |
Standard |
Power Rating |
0.5W & 1W |
Resistance Value |
1~200mΩ |
Operating Temperature Range |
-55 to +170°C |
Component Temperature Coefficient (TCR) |
± 50ppm/°C & 380ppm/°C |
Maximum Working Voltage (V) |
(P×R)1/2 |
Rating Current (A) |
(P/R)1/2 |
P=Power Rating; R=Resistance Value
Standard Electrical Specifications
Type |
Rating Power at 70℃ |
T.C.R. (ppm/℃) |
Resistance Range(mΩ) 0.5%(D) 1.0%( F) 2.0%( G) 5.0%( J) |
Meterial |
Electrode |
Operating Temperature(℃) |
LMJ12 |
1W |
380 |
1~100 |
R001~R100: MnCu |
R001 |
-55~+170°C |
50 |
R001: (S) |
R002~R100 |
0.5W |
50 |
101~200 |
R101~R200:MnCu |
R101~R200 |
Dimensions

Unit: Millimeters
Type |
Resistance Range (mΩ) |
L |
W |
C |
T |
LMJ 12 |
1 |
3.2 ±0.2 |
1.6 ±0.2 |
1.2 ±0.2(S) |
0.7± 0.15 |
1~200 |
3.2 ±0.2 |
1.6 ±0.2 |
0.5±0.2 |
0.7± 0.15 |
Recommended land pattern
Resistance Range ( mΩ ) |
a |
b |
L |
1 (S) |
1.8±0.1 |
2.3±0.1 |
1.0±0.1 |
1~200 |
1.8±0.1 |
1.7±0.1 |
1.6±0.1 |
Tapping & Package

Type |
Pack |
A ±0.2 |
B ±0.2 |
D0+0.5-0 |
E ±0.1 |
F ±0.05 |
P0 ±0.1 |
P1 ±0.1 |
P2 ±0.1 |
W ±0.2 |
T ±0.15 |
1206 |
Paper |
2.00 |
3.60 |
1.50 |
1.75 |
3.50 |
4.00 |
4.00 |
2.00 |
8.00 |
0.81 |
Reel Specification

Type |
A |
B |
C |
D |
M |
W |
1206 |
2.00±0.5 |
13.5±0.5 |
21.00±0.5 |
60.00±1.0 |
178.00±2.0 |
9.00±0.5 |
Product Characteristics
Item |
Test condition/ Methods |
Limited |
Standard |
Resistance |
Measuring resistance value at room temperature 25℃±5℃ |
Refer to Spec |
IEC60115-1 4.5 |
Temperature coefficient of resistance |
TCR =(R-R0)/R0(T2-T1)X 106 R0 : resistance of room temperature R: resistance of 125℃ T1: Room temperature T2: Temperature at 125℃ |
Refer to Spec |
MIL-STD-202 Method 304 |
Short time Overload |
5×Rated power for 5 seconds |
≤±0.5% |
MIL-STD-202 Method 210 |
Resistance to Soldering Heat |
260℃± 5℃ time :10sec± 1sec |
≤±0.5% |
MIL-STD-202 Method 210 |
Temperature Cycling |
-55℃(30min)/+125℃(30min), 1000 cycles |
≤±0.5% |
MIL-STD-202 Method107G |
Low temperature Storage |
-55℃ for 1000hours, No power |
≤±0.5% |
MIL-STD-26E |
High Temperature Storage |
125℃ for 1000hours, No power |
≤±1% |
IEC6011501-4.25 |
Bias Humidity |
+85℃, 85% RH ,10%bias, 1.5 h "ON", 0.5 h "OFF" ,1000hours |
≤±0.5% |
MIL-STD-202 Method103 |
Joint Strength of Solder |
Soldered on the bending test plate, put on the bending testing machine, pressed under force in the center of the test plate, measure its resistance variance rate under load |
≤±0.5% |
JIS-C5201 |
Solderability |
Temperature of Solder :245±5℃ Dipping time:3±1s |
Solder coverage over 95% |
IEC60115-1 4.17 |
Load life |
1000 h at 70 °C , 1.5 h "ON", 0.5 h "OFF" |
≤±1% |
JIS-C5201 |
Operational life |
125℃± 3℃, 1000 hours, at rated power |
≤±0.5% |
MIL-STD-202 Method 108 |
Derating Curve

Packaging
Quantity: 5, 000pcs
8mm wide tape on 178mm(7 inch)
diameter reel -specification EIA
Standard 481.