LMS06
Description
- Proprietary processing technique produces
- extremely low resistance values
- Very low inductance
- Low thermal EMF
- Metal Foil
Part Numbering System
| Parameter | Standard |
|---|---|
| Power Rating | 0.5W /0.75W/1.0W |
| Resistance Value | 3~200mΩ |
| Operating Temperature Range | -55 to +155℃ |
| Component Temperature Coefficient(TCR) | ±50 ppm/℃ |
| Maximum Working Voltage (V) | (PxR)1/2 |
| Rating current (A) | (P/R)1/2 |
P=Power Rating; R=Resistance Value
Standard Electrical Specifications
| Type | Rating Power at 70℃ |
T.C.R. (ppm/℃) |
Resistance Range (mΩ) F:±1.0% G:±2.0% J:±5.0% |
Operating Temperature(℃) |
|---|---|---|---|---|
| LMS06 | 0.5W | ±50 | 3-20 | -55~+155℃ |
| LMS08 | 0.75W | 5-100 | ||
| LMS12 | 1.0W | 3-200 |
Dimensions
Unit: Millimeters
| Type | L | W | C | T |
|---|---|---|---|---|
| LMS06 | 1.60±0.20 | 0.8±0.20 | 0.40±0.20 | 0.60±0.20 |
| LMS08 | 2.00±0.20 | 1.25±0.20 | 0.40±0.30 | 0.70±0.20 |
| LMS12 | 3.20±0.20 | 1.60±0.20 | 0.50±0.30 | 0.70±0.20 |
Recommended land pattern
Unit: Millimeters
| Series | Resistance(mΩ) | A | L | B |
|---|---|---|---|---|
| LMS06 | 3≤R≤20 | 1.0 | 0.6 | 1.1 |
| LMS08 | 5≤R≤100 | 1.4 | 1.2 | 1.0 |
| LMS12 | 5≤R≤35 | 1.8 | 1.6 | 1.55 |
| 36≤R≤200 | 2.2 | 1.35 |
Derating Curve
Recommend Wave-Solder profile
ProductCharacteristics
| Item | Test condition/Methods | Limited | Standard |
|---|---|---|---|
| Resistance | Measuring resistance value at room temperature 25℃±5℃ |
Refer to Spec | IEC60115-14.5 |
| Temperature coefficient of resistance |
TCR=(R-R0)/R0(T2-T1)X 10⁶ T1 T2 R0:resistance of room temperature R:resistance of 125℃ T1:Room temperature T2:Temperature at 125℃ |
Refer to Spec | MIL-STD-202 Method 304 |
| Short time Overload | 5 X rated power for 5s | ≤±1% | MIL-R-26E |
| Resistance to Soldering Heat |
260℃±5℃ time:10sec±1sec | ≤±0.5% | MIL-STD-202 Method 210 |
| Temperature Cycling | -55℃(30min)/+125℃(30min),1000 cycles,24 ±4 hours |
≤±1% | MIL-STD-202 Method107G |
| Moisture Resistance |
T=24 hours /Cycle,10 Cycles.Notes:Steps 7a& 7b not required.Unpowered |
≤±1% | MIL-STD-202 |
| High Temperature Storage |
125℃ for 1000hours,24±4 hours,No power | ≤±1% | IEC6011501-4.25 |
| Bias Humidity | +85℃,85%RH,10%bias1.5 hours “ON”,0.5 hours “OFF”,1000hours |
≤±1% | MIL-STD-202 Method103 |
| Solderability | 235±3℃,3±0.5sec | >95%area covered with tin |
IEC60115-1-4.17 JIS-C5201-4.17 |
| Mechanical Shock | Wave Form:Tolerance for half sine shock pluse. Peak value is 100g’s.Normal duration(D)is 6(ms) |
<±1% | MIL-STD-202 |
| Operational life | 125℃,1000 hours,at 35%rated power | ≤±2% | MIL-STD-202 Method 108 |
| Vibration | 5 g's for 20 min.,12 cycles each of 3 orientations Note:Test from 10-2000 Hz. |
<±1% | MIL-STD-202 |
| Thermal Shock | -55°℃/+155℃.Note:Number of cycles required-300,Maximum transfer time-20 seconds, Dwell time-15 minutes.Air-Air. |
<±1% | MIL-STD-202 |
| ESD | verify the voltage setting at 500V | <±1% | AEC-Q200-002 |
| Board Flex (Bending) |
The duration of the applied forces shall be 60 (+5)Sec 3mm deflection |
<±1% | AEC-Q200-005 |
| Terminal Strength (SMD) |
LMS06~LMS12:Force of 1.8kg for 60 seconds Remarks:0201-NA |
<±1% | AEC-Q200-006 |
Tapping & Package
| Type | Pack | A ±0.15 |
B ±0.2 |
W ±0.2 |
E ±0.1 |
F ±0.05 |
P0 ±0.1 |
P1 ±0.1 |
P2 ±0.1 |
D0 ±0.1 |
T ±0.1 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 0603 | Emboss | 1.10 | 1.90 | 8.0 | 1.75 | 3.50 | 4.00 | 4.00 | 2.00 | 1.55 | 0.85 |
| 0805 | Emboss | 1.60 | 2.40 | 8.0 | 1.75 | 3.50 | 4.00 | 4.00 | 2.00 | 1.55 | 1.05 |
| 1206 | Emboss | 2.00 | 3.60 | 8.0 | 1.75 | 3.50 | 4.00 | 4.00 | 2.00 | 1.55 | 1.05 |
Reel Specification
Unit: Millimeters
| Type | A | B | C | W | T |
|---|---|---|---|---|---|
| 0603 | 180±2 | 60±1 | 13±1 | 9±1 | 11.4±1 |
| 0805 | |||||
| 1206 |
Packaging
| Type | LMS06 | LMS08 | LMS12 |
|---|---|---|---|
| Quantity(pcs) | 5,000 | 4,000 | 4,000 |