0603TD-1.5A-L
Ultra-Thin Fuse | 0.06x0.03’’
Time Delay series Thin Film Chip Fuse
Features
- Low DCR
- High inrush current withstanding capability
- High reliability
- Fiberglass enforced epoxy fuse body
- Copper termination with nickel and tin plating layer
- Halogen free, RoHS compliance & lead-free
Application
- Panel
- HDD
- Toy
- IoT
- Battery pack
- Finger print
- Smart lock
- Notebook
Electrical Characteristics
| % of Current Rating | Opening Time |
|---|---|
| 100% | 4hours min. |
| 200% | 5second max. |
| 300% | 0.2second max. |
Specifications
| Part No. | Current Rating(A) |
Voltage Rating (Vdc) |
Interrupting Rating |
Typical Cold DCR (Ω) |
Typical I2t (A2Sec)* |
Marking |
|---|---|---|---|---|---|---|
|
0603TD-1.5A-L
|
1.5
|
35 | 35A @35V |
0.05
|
0.082
|
N |
*Typical I2t: i.e. melting I2t at 0.001s of current rating
Dimension
Packaging
- Quantity: 5, 000pcs
- 8mm wide tape on 178mm (7 inch) diameter reel -specification EIA Standard 481
Soldering Parameters
Wave Soldering: 260°C, 10 secondsmax.
Infrared Reflow: 260°C, 30 seconds max.
IR Reflow Profile
| Preheat Heat | |
|---|---|
| Temperature min (Tsmin） | 150°C |
| Temperature max(Tsmax) | 200°C |
| Time (Tsmin to Tsmax) (ts) | 60 -120 seconds |
| Average ramp-up rate (Tsmax to Tp) | 3°C/second max. |
| Liquidous temperature (TL) | 217 °C |
| Time at liquidous (tL) | 60 - 150 seconds |
| Peak temperature(Tp) | 260°C |
| Time within 5°C of actual peak Temperature (tp) | 30 seconds |
| Average ramp-down rate (Tp to Tsmax) | 6°C/second max. |
| Time 25 °C to peak temperature | 8 minutes max. |
Temperature Effect on Current Rating
- Normal ambient temperature: 23+/-3℃
- Operating temperature: -55 ~ 105℃
Average Time-Current curve
